IPC A-610F - Amendment 1 Acceptability of Electronic Assemblies - Amendment 1 Amendment by Association Connecting Electronics Industries, 12/01/2015
IPC 1072 Intellectual Property Protection in Electronic Assembly Manufacturing standard by Association Connecting Electronics Industries, 12/01/2015
IPC WP-116 Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan standard by Association Connecting Electronics Industries, 12/01/2015
IPC HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations standard by Association Connecting Electronics Industries, 11/01/2015
IPC 6903 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2015
IPC 6012D Qualification and Performance Specification for Rigid Printed Boards standard by Association Connecting Electronics Industries, 09/01/2015
IPC 6012DS Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards Amendment by Association Connecting Electronics Industries, 2015
IPC WP-1081 White Paper on Conflict Minerals Due Diligence Guidance standard by Association Connecting Electronics Industries, 07/01/2015
IPC 4101E Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 07/01/2015
IPC 4101D-WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1 standard by Association Connecting Electronics Industries, 07/01/2015
IPC 6901 Application Categories for Printed Electronics standard by Association Connecting Electronics Industries, 07/01/2015
IPC T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 05/01/2015