Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
New
Reduced price!
View larger
View larger
IEC 61191-3 Ed. 2.0 b:2017
M00013476
New product
IEC 61191-3 Ed. 2.0 b:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
standard by International Electrotechnical Commission, 05/30/2017
In stock
More info
Full Description
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.